Fabrication of complex structures on nonplanar surfaces through a transfer method

Journal of Microelectromechanical Systems

Volumn 20, Issue 1, 2011, Pages 6-8

  Zeng, Xuefeng ^a   Jiang, Hongrui ^b  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Fabrication; flexible substrate; high aspect ratio; nonplanar surface

Indexed keywords

COMPLEX MICROELECTROMECHANICAL SYSTEMS; COMPLEX STRUCTURE; CURVILINEAR SURFACES; FLEXIBLE MEMBRANES; FLEXIBLE POLYMERS; FLEXIBLE SUBSTRATE; HIGH ASPECT RATIO; MEMS-STRUCTURE; MEMSDEVICES; NON-PLANAR SURFACES; SILICON ON INSULATOR WAFERS; SILICON SUBSTRATES; TRANSFER METHOD;

COMPOSITE MICROMECHANICS; FABRICATION; FUNCTIONAL POLYMERS; MEMS; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

ASPECT RATIO;

EID: 79551587344     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2100034     Document Type: Article

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