A transfer method for complex structures fabricated on non-planar surfaces

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Volumn , Issue , 2011, Pages 402-405

  Zeng, X ^a   Huang, C C ^a   Jiang, H ^a,b  

^a University of Wisconsin Madison   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Fabrication; Flexible substrate; High aspect ratio; Non planar surface

Indexed keywords

3-DIMENSIONAL; COMPLEX STRUCTURE; FLEXIBLE MEMBRANES; FLEXIBLE SUBSTRATE; HIGH-ASPECT RATIO; MEMS-STRUCTURE; MEMSDEVICES; NON-PLANAR SURFACES; SILICON ON INSULATOR WAFERS; TRANSFER METHOD;

ACTUATORS; ASPECT RATIO; COMPOSITE MICROMECHANICS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; PHOTORESISTS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

SOLID-STATE SENSORS;

EID: 80052115676     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TRANSDUCERS.2011.5969488     Document Type: Conference Paper

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