Nanoscale material removal mechanism of soft-brittle HgCdTe single crystals under nanogrinding by ultrafine diamond grits

Tribology Letters

Volumn 46, Issue 1, 2012, Pages 95-100

  Zhang, Zhenyu ^a   Song, Yaxing ^a   Huo, Fengwei ^a   Guo, Dongming ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Grinding; Non ferrous alloys; SEM; TEM; Wear mechanisms

Indexed keywords

CHIP THICKNESS; DAMAGE-FREE; DAMAGED LAYERS; HGCDTE; MECHANICAL MACHINING; NANO-GRINDING; NANO-SCALE MATERIALS; NONFERROUS ALLOY; ULTRAFINE DIAMOND; WEAR MECHANISMS;

GRINDING (MACHINING); HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MERCURY COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY; TRIBOLOGY;

NANOTECHNOLOGY;

EID: 84862777836     PISSN: 10238883     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11249-012-9924-9     Document Type: Article

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