Study on structural, morphological and electrical properties of sputtered titanium nitride films under different argon gas flow

Materials Chemistry and Physics

Volumn 134, Issue 2-3, 2012, Pages 839-844

  Arshi, Nishat ^a   Lu, Junqing ^a   Joo, Yun Kon ^a   Lee, Chan Gyu ^a   Yoon, Jae Hong ^a   Ahmed, Faheem ^a  

^a Changwon National University   (South Korea)

Author keywords

Electrical characterization; Nitrides; Sputtering; Thin films

Indexed keywords

ARGON FLOW; ARGON FLOW RATE; ARGON GAS; COLUMNAR GRAIN STRUCTURE; DC MAGNETRON SPUTTERING TECHNIQUE; ELECTRICAL CHARACTERIZATION; ELECTRICAL RESISTIVITY MEASUREMENTS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; GRAIN SIZE; PREFERRED ORIENTATIONS; RESISTIVITY VALUES; SILICON (100); STRUCTURAL AND MORPHOLOGICAL PROPERTIES; TIN FILMS; TITANIUM NITRIDE FILMS; XRD PATTERNS;

ELECTRIC CONDUCTIVITY; FIELD EMISSION MICROSCOPES; GRAIN SIZE AND SHAPE; NITRIDES; SPUTTERING; THIN FILMS; X RAY DIFFRACTION;

TITANIUM NITRIDE;

EID: 84861532448     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2012.03.078     Document Type: Article

References (25)

1. S. Veprek, G.J. Maritza, V. Heijman, P. Karvankova, and J. Prochazka Thin Solid Films 476 2005 1
2. B. Szikora Vacuum 50 3-4 1998 273
3. S. Niyomsoan, W. Grant, D.L. Olson, and B. Mishra Thin Solid Films 415 2002 187
4. S. Chatterjee, S. Chanrashekhar, and T.S. Sudarshan J. Mater. Sci. 27 1992 3409
5. J. Schreckenbach, F. Schlottig, D. Dietrich, A. Hofmann, and G. Merx J. Mater. Sci. 14 1995 1344
6. S.W. Russell, M.J. Rack, D. Adams, and T.L. Alford J. Electrochem. Soc. 143 1996 2349
7. W. Tsai, J. Fair, and D. Hodul J. Electrochem. Soc. 139 1992 2004
8. M. Kawamura, Y. Abe, H. Yanagisawa, and K. Sasaki Thin Solid Films 287 1996 115
9. I. Safi Surf. Coat. Technol 127 2000 203
10. J.E. Sendgren Thin Solid Films 128 1985 21
11. J. Pelleg, L.Z. Zevin, and S. Lungo Thin Solid Films 197 1991 117
12. J.P. Zhao, X. Wang, Z.Y. Chen, S.Q. Yang, T.S. Shi, and X.H. Liu J. Phys. D: Appl. Phys. 30 1997 5
13. B.E. Warren X-ray Diffraction 1969 Addison Wesley Publishing Co. London
14. G.Q. Yu, B.K. Tay, S.P. Lau, K. Prasad, L.K. Pan, J.W. Chai, and D. Lai Chem. Phys. Lett. 374 2003 264
15. R. Manory Surf. Eng. 3 1987 233
16. S. Inoue, K. Tominaga, R.P. Howson, and K. Kusaka J. Vac. Sci. Technol. A 13 1995 2808
17. H.H. Huang, and M.H. Hon Thin Solid Films 416 2002 54
18. R. Kroger, M. Eizenberg, C. Marcadal, and L. Chen J. Appl. Phys. 91 2002 5149
19. W. Sinke, G.P.A. Frijlink, and F.W. Saris Appl. Phys. Lett. 47 1985 471
20. J.E. Sendgren, B.O. Johansson, A. Rockett, S.A. Barnett, and J.E. Greene W.D. Sproul, J.E. Greene, J.A. Thornton, Physics and Chemistry of Protective Coatings 1986 American Institute of Physics MA 95
21. Li-Jian Meng, and M.P. dos Santos Surf. Coat. Technol. 90 1997 64
22. N. Saoula, S. Djerourou, K. Yahiaoui, K. Henda, R. Kesri, R.M. Erasmusand, and J.D. Comins Surf. Interface Anal. 42 2010 1176
23. B. Fritsche, T. Chevolleau, J. Kourtev, A. Kolitsch, and W. Moller Vacuum 69 2002 139
24. M.W. Thompson, B.W. Farmery, and P.A. Newson Philos. Mag. 18 1968 361
25. J. Lu, and C.G. Lee Vacuum 86 2012 1134