Titanium nitridation on copper surfaces

Journal of the Electrochemical Society

Volumn 143, Issue 7, 1996, Pages 2349-2353

  Russell, S W ^a,e   Rock, M J ^b   Adams, Daniel ^a   Alford, T L ^a   Levine, T E ^c,f   Nastasi, M ^d  

^a ARIZONA STATE UNIVERSITY   (United States)

^b Arizona State University   (United States)

^c Cornell University   (United States)

^d LOS ALAMOS NATIONAL LABORATORY   (United States)

^e TEXAS INSTRUMENTS   (United States)

^f APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; AUGER ELECTRON SPECTROSCOPY; CHEMICAL BONDS; COPPER ALLOYS; DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); METALLIC FILMS; SEGREGATION (METALLOGRAPHY); SURFACE TREATMENT; THERMAL EFFECTS; TITANIUM NITRIDE;

ELASTIC RECOIL DETECTION; TITANIUM NITRIDATION;

COPPER;

EID: 0030192508     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837005     Document Type: Article

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