Electroless deposition of copper on organic and inorganic substrates using a Sn/Ag catalyst

Journal of the Electrochemical Society

Volumn 159, Issue 6, 2012, Pages

  Fritz, Nathan ^a   Koo, Hyo Chol ^a   Wilson, Zachary ^a   Uzunlar, Erdal ^a   Wen, Zhongsheng ^a   Yeow, Xinyi ^a   Bidstrup Allen, Sue Ann ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ETCHING; COST-EFFICIENT; ELECTROLESS; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; INORGANIC SUBSTRATES; OXIDIZED SILICON WAFERS; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; ROOM TEMPERATURE; ROUGHENED SURFACES; THROUGH-SILICON-VIA;

ADHESION; CATALYSTS; COPPER; OLIGOMERS; SILICA; SILICON OXIDES;

ELECTROLESS PLATING;

EID: 84861367583     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.099206jes     Document Type: Article

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