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Volumn , Issue , 2010, Pages
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Characterisation of silver particles used for the low temperature joining technology
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE STRENGTH;
CHARACTERISATION;
CHEMICAL IMPURITIES;
COATING TIME;
ENDOTHERMIC REACTIONS;
INDUCTIVELY COUPLED PLASMA-OPTICAL EMISSION SPECTROMETRY;
INFORMATION CONCERNING;
JOINING TECHNOLOGY;
LEAD CONTAINING SOLDERS;
LOW TEMPERATURES;
MASS LOSS;
MASS SPECTROSCOPY;
PARTICLE MORPHOLOGIES;
SECONDARY ION MASS SPECTROSCOPY;
SEM;
SHEAR FORCE;
SHEAR TESTS;
SILVER PARTICLES;
SILVER POWDERS;
SINTERED JOINT;
SPHERICAL PARTICLE;
THERMOGRAVIMETRY;
TOF SIMS;
DIFFERENTIAL SCANNING CALORIMETRY;
ELECTROMAGNETIC INDUCTION;
INDUCTIVELY COUPLED PLASMA;
JOINING;
MASS SPECTROMETERS;
MORPHOLOGY;
OPTICAL EMISSION SPECTROSCOPY;
ORGANIC COATINGS;
POWDERS;
SCANNING ELECTRON MICROSCOPY;
SECONDARY ION MASS SPECTROMETRY;
SINTERING;
TECHNOLOGY;
THERMOGRAVIMETRIC ANALYSIS;
SILVER;
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EID: 78651345173
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESTC.2010.5642806 Document Type: Conference Paper |
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Times cited : (6)
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References (7)
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