Reliability analysis of low temperature low pressure Ag-sinter die attach

Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011

Volumn 2, Issue , 2011, Pages 149-154

  Mrossko R ^a   Oppermann, H ^b   Wunderle, B ^c,d   Michel, B ^c  

^a BERLINER NANOTEST UND DESIGN GMBH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^d CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Die attach; Nano indentation; Reliability; Sinter silver; Thermal interface

Indexed keywords

CHARACTERIZATION METHODS; CHIP-ON-BOARD; CYCLING CONDITIONS; DIE-ATTACH MATERIALS; INTERFACE MATERIALS; LOW CYCLE FATIGUES; LOW PRESSURES; LOW TEMPERATURES; POWER APPLICATIONS; THERMAL INTERFACES; THERMOMECHANICAL RELIABILITY;

CHARACTERIZATION; DIES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FLUIDICS; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; NANOTECHNOLOGY; POWER ELECTRONICS; RELIABILITY; SILVER; SINTERING; SOLDERING; THERMAL CONDUCTIVITY;

RELIABILITY ANALYSIS;

EID: 81455133445     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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