Wettability effects of immersion tin final finishes with lead free solder

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 561-566

  Hetschel, Thomas ^a,b   Wolter, Klaus Jürgen ^b   Phillipp, Fritz ^c  

^a ROBERT BOSCH GMBH   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^c MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC TEMPERATURE; BRAZING; EARTH ATMOSPHERE; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; LEAD; MELTING POINT; METAL RECOVERY; OXIDATION; OXIDES; OXYGEN; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TIN; TITANIUM COMPOUNDS; WELDING; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

AMORPHOUS MIXTURES; CHARACTERISATION; FLUX SYSTEMS; HIGH RESOLUTIONS; HIGH TEMPERATURES; IMMERSION TINS; LEAD-FREE; LEAD-FREE SOLDERS; NITROGEN ATMOSPHERE.; OXIDATION PROCESSES; OXIDATION STATES; OXIDE LAYERS; OXIDE REGIONS; OXYGEN ATMOSPHERES; REFLOW CYCLES; SOLDERABILITY; SURFACE CONDITIONS; TEMPERATURE PROFILES; THIN OXIDE LAYERS; WETTING BEHAVIOURS; XPS ANALYSES;

TIN OXIDES;

EID: 58149092171     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684411     Document Type: Conference Paper

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