Silver-polyaniline-epoxy electrical conductive adhesives - A percolation threshold analysis

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 180-184

  Gumfekar, Sarang P ^a   Chen, Alex ^b   Zhao, Boxin ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

^b Celestica Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AMINE HARDENER; CONDUCTIVE FILLERS; ELECTRICAL CONDUCTIVE ADHESIVES; ELECTRONIC MANUFACTURING; ENHANCED CONDUCTIVITY; EPOXY ADHESIVES; EPOXY MATRICES; FINE-PITCH CAPABILITY; INTERFACIAL POLARIZATION; INTRINSIC DIFFERENCES; PACKAGING INDUSTRY; PERCOLATION THRESHOLDS; POLYMERIC MATRICES; PROCESSING CONDITION; PROCESSING STEPS; REDUCING PROCESS; SOLDERING TECHNOLOGY; SYSTEMATIC STUDY; WELL-DISPERSED;

ADHESIVES; CURING; ELECTRONICS PACKAGING; EPOXY RESINS; FILLERS; LIQUIDS; LOADING; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); POLYANILINE; RESINS; SURFACE PROPERTIES;

SILVER;

EID: 84860895906     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184411     Document Type: Conference Paper

References (15)

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