SCOPUS 정보 검색 플랫폼

International Journal of Polymeric Materials and Polymeric Biomaterials

Volumn 59, Issue 12, 2010, Pages 994-1007

Development of polyaniline/epoxy composite as a pospective solder replacement material

(2) Mir, Irfan Ahmad a Kumar, D a

a DELHI TECHNOLOGICAL UNIVERSITY (India)

Author keywords

conductive adhesives; polymer composite materials; solder replacement

Indexed keywords

ANHYDRIDE-CURED EPOXY; CONDUCTING FILLERS; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; DROP TEST; FILLER CONCENTRATION; FOUR-PROBE METHODS; IMPACT PROPERTY; ISOTROPICALLY CONDUCTIVE ADHESIVES; LAP SHEAR; MATERIAL CHARACTERIZATIONS; NOVEL APPLICATIONS; POLYMER COMPOSITE MATERIALS; PROTONIC ACID; SEM; SOLDER REPLACEMENT;

ACIDS; ADHESIVES; CONDUCTING POLYMERS; DOPING (ADDITIVES); FILLERS; ORGANIC CONDUCTORS; POLYANILINE;

FILLED POLYMERS;

EID: 77958174506 PISSN: 00914037 EISSN: 1563535X Source Type: Journal
DOI: 10.1080/00914037.2010.504150 Document Type: Article

Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.