Effect of different types of silver and epoxy systems on the properties of silver/epoxy conductive adhesives

Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 7, 2011, Pages 757-764

  Anuar, S Khairul ^a   Mariatti, M ^a   Azizan, A ^a   Mang, N Chee ^b   Tham, W T ^b  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

^b Penchem Technologies Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE SYSTEMS; COEFFICIENTS OF THERMAL EXPANSIONS; CONDUCTIVE ADHESIVE; CROSS-LINKING DENSITY; ELECTRICAL CONDUCTIVITY; EPOXY SYSTEMS; FILLER LOADING; FLEXURAL MODULUS; HIGH ELECTRICAL CONDUCTIVITY; LOW CTE; PERCOLATION THRESHOLDS; THERMAL EXPANSION PROPERTIES;

ADHESIVES; ELECTRIC CONDUCTIVITY; EXPANSION; SOLVENTS; THERMAL EXPANSION;

SILVER;

EID: 80051666517     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0207-7     Document Type: Article

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