Mesoscale modeling of phononic thermal conductivity of porous Si: Interplay between porosity, morphology and surface roughness

Journal of Computational Electronics

Volumn 11, Issue 1, 2012, Pages 8-13

  Romano, Giuseppe ^a   Di Carlo, Aldo ^b   Grossman, Jeffrey C ^a  

^a Massachusetts Institute of Technology   (United States)

^b UNIVERSITY OF ROME TOR VERGATA   (Italy)

Author keywords

Boltzmann; Thermal conductivity; Thermoelectrics

Indexed keywords

BOLTZMANN; BOLTZMANN TRANSPORT EQUATION; DIFFERENT LENGTH SCALE; EFFECTIVE THERMAL CONDUCTIVITY; ELECTRICAL TRANSPORT MODEL; FIGURE OF MERITS; HEAT TRANSPORT; MESOSCALE MODELING; MOLECULAR DYNAMICS SIMULATIONS; MULTISCALE FINITE ELEMENT; PHONON MEAN FREE PATH; PORE SPACING; PORE WALL; POROUS SI; SPECULARITIES; SURFACE-TO-VOLUME RATIO; THERMOELECTRIC DEVICES; THERMOELECTRICS;

FINITE ELEMENT METHOD; MOLECULAR DYNAMICS; PHONONS; PORE SIZE; POROUS MATERIALS; POROUS SILICON; SURFACE ROUGHNESS;

THERMAL CONDUCTIVITY;

EID: 84860888703     PISSN: 15698025     EISSN: 15728137     Source Type: Journal    
DOI: 10.1007/s10825-012-0390-2     Document Type: Article

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