Effect of CF4 plasma treatment on the interfacial fracture energy between inkjet-printed Ag and flexible polyimide films

Surface and Coatings Technology

Volumn 205, Issue 2, 2010, Pages 423-429

  Park, Sung Cheol ^a   Park, Young Bae ^a  

^a Andong National University   (South Korea)

Author keywords

Adhesion; CF4 plasma treatment; Inkjet printed Ag; Peel test; Polyimide

Indexed keywords

CF4 PLASMA TREATMENT; CHEMICAL BONDINGS; FLEXIBLE POLYIMIDE; FLEXIBLE PRINTED CIRCUIT BOARDS; INK-JET PRINTING; INKJET-PRINTED AG; INTERFACIAL ADHESIONS; INTERFACIAL FRACTURE ENERGY; MECHANICAL INTERLOCKING; METALLIZATION TECHNIQUES; PEEL TESTS; PLASMA TREATMENT; POLYIMIDE FILM; SURFACE FUNCTIONAL GROUPS;

ADHESION; CHEMICAL BONDS; FRACTURE; FRACTURE ENERGY; FUNCTIONAL GROUPS; PEELING; PLASMA APPLICATIONS; PLASMAS; POLYIMIDES; POLYMERIC FILMS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SURFACE ROUGHNESS;

SILVER;

EID: 77956428077     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.07.005     Document Type: Article

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