-
1
-
-
0019563707
-
High-performance heat sinking for VLSI
-
PP
-
Tuckerman, D. B. and Pease, R. F. W.; High-performance heat sinking for VLSI; IEEE Electron device Lett., vol. EDL-2, 1981, PP. 126-129.
-
(1981)
IEEE Electron device Lett
, vol.EDL-2
, pp. 126-129
-
-
Tuckerman, D.B.1
Pease, R.F.W.2
-
2
-
-
51249172090
-
Convective heat transfer in microchannels
-
Samalam, V. K.; Convective heat transfer in microchannels; J. Electron mater., vol. 18, 1989, pp. 611-617.
-
(1989)
J. Electron mater
, vol.18
, pp. 611-617
-
-
Samalam, V.K.1
-
4
-
-
0342948889
-
Three dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
-
Fedorov, A. G. and Viskanta, R.; Three dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging; Int. J. Heat Mass Transfer, vol. 43, 2000, pp. 399-415.
-
(2000)
Int. J. Heat Mass Transfer
, vol.43
, pp. 399-415
-
-
Fedorov, A.G.1
Viskanta, R.2
-
5
-
-
0032290339
-
-
Kawano, K.; Minakami, K.; Iwasaki, H.; Ishizuka, M.; Application of Heat Transfer in Equipment Systems, and Education; in Development of microchannels heat exchanging, R.A. Nelson Jr., L. W. Swanson, M.V.A. Bianchi, and C. Camci, Eds. New York: ASME, 1998, HTD-361-3/PID-3, 1998, pp. 173-180.
-
Kawano, K.; Minakami, K.; Iwasaki, H.; Ishizuka, M.; Application of Heat Transfer in Equipment Systems, and Education; in Development of microchannels heat exchanging, R.A. Nelson Jr., L. W. Swanson, M.V.A. Bianchi, and C. Camci, Eds. New York: ASME, 1998, vol. HTD-361-3/PID-3, 1998, pp. 173-180.
-
-
-
-
6
-
-
0023421550
-
A thermal module design for advancing packaging
-
Turlik, L. T. I. and Reisman, A.; A thermal module design for advancing packaging; J. Electron Mater., vol. 16, no. 5, 1987, pp. 347-355.
-
(1987)
J. Electron Mater
, vol.16
, Issue.5
, pp. 347-355
-
-
Turlik, L.T.I.1
Reisman, A.2
-
7
-
-
0027841770
-
-
Rahman, M. M. and Gui, F.; Experimental measurements of fluid flow and heat transfer in microchannel cooling passages in a chip substrate; Adv. Electron. Packag., ASME EEP-4, no. 2, 1993, pp. 685-692.
-
Rahman, M. M. and Gui, F.; Experimental measurements of fluid flow and heat transfer in microchannel cooling passages in a chip substrate; Adv. Electron. Packag., vol. ASME EEP-4, no. 2, 1993, pp. 685-692.
-
-
-
-
8
-
-
13844280952
-
Analysis and optimization of the thermal performance of microchannel heat sinks
-
Liu, D. and Gerimella, S. V.; Analysis and optimization of the thermal performance of microchannel heat sinks; International Journal for numerical methods in Heat and Fluid flow, vol. 15, No. 1, 2005, pp. 7-26.
-
(2005)
International Journal for numerical methods in Heat and Fluid flow
, vol.15
, Issue.1
, pp. 7-26
-
-
Liu, D.1
Gerimella, S.V.2
-
9
-
-
0037570768
-
Friction factors in smooth trapezoidal silicon micro channels with different aspect ratios
-
Jul
-
Wu, H. Y. and Cheng, P.; Friction factors in smooth trapezoidal silicon micro channels with different aspect ratios; Int. J. Heat Mass Transf., vol. 46, no. 14, Jul. 2003, pp. 2519-2525.
-
(2003)
Int. J. Heat Mass Transf
, vol.46
, Issue.14
, pp. 2519-2525
-
-
Wu, H.Y.1
Cheng, P.2
-
10
-
-
0037908834
-
An experimental study of convective heat transfer in silicon micro channels with different surface conditions
-
Jul
-
Wu, H. Y. and Cheng, P.; An experimental study of convective heat transfer in silicon micro channels with different surface conditions; Int. J. Heat Mass Transf., vol. 46, no. 14, Jul. 2003, pp. 2547-2556.
-
(2003)
Int. J. Heat Mass Transf
, vol.46
, Issue.14
, pp. 2547-2556
-
-
Wu, H.Y.1
Cheng, P.2
-
11
-
-
85162221694
-
Transport in micro channels-A critical review; Annu
-
Gerimella, S. V. and Sobhan, C. B.; Transport in micro channels-A critical review; Annu. Rev. Heat Tansf., vol. 13, 2003, pp. 1-50.
-
(2003)
Rev. Heat Tansf
, vol.13
, pp. 1-50
-
-
Gerimella, S.V.1
Sobhan, C.B.2
-
12
-
-
0030201144
-
Convective heat transfer and flow friction for water flow in microchannel structures
-
Jul
-
Peng, X. F. and Peterson, G. P.; Convective heat transfer and flow friction for water flow in microchannel structures; Int. J. Heat Mass Transf, vol. 39, no. 12, Jul. 1996, pp. 2599-2608.
-
(1996)
Int. J. Heat Mass Transf
, vol.39
, Issue.12
, pp. 2599-2608
-
-
Peng, X.F.1
Peterson, G.P.2
-
13
-
-
2542481532
-
-
Knight, R. W.; Hall, D. J.; Goodling, J. S. and Jaeger, R. C.; Heat sink optimization with application to micro channels, IEEE Trans. Compon., Hybrids, Manufact. Technol., 15, no. 5, Oct. 1992, pp. 832-842.
-
Knight, R. W.; Hall, D. J.; Goodling, J. S. and Jaeger, R. C.; Heat sink optimization with application to micro channels," IEEE Trans. Compon., Hybrids, Manufact. Technol., vol. 15, no. 5, Oct. 1992, pp. 832-842.
-
-
-
-
14
-
-
0037804797
-
Optimization study of stacked micro-channel heat sinks for micro-electronic cooling
-
Mar
-
Wei, X. J. and Joshi, Y.; Optimization study of stacked micro-channel heat sinks for micro-electronic cooling; IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, Mar. 2003, pp. 55-61.
-
(2003)
IEEE Trans. Compon. Packag. Technol
, vol.26
, Issue.1
, pp. 55-61
-
-
Wei, X.J.1
Joshi, Y.2
-
15
-
-
0035521208
-
Optimal shapes of fully embedded channels for conjugate cooling
-
Nov
-
Fisher, T. S. and Torrance, K. E.; Optimal shapes of fully embedded channels for conjugate cooling; IEEE Trans. Adv. Packag., vol. 24, no. 4, Nov. 2001, pp. 555-562.
-
(2001)
IEEE Trans. Adv. Packag
, vol.24
, Issue.4
, pp. 555-562
-
-
Fisher, T.S.1
Torrance, K.E.2
-
16
-
-
0026939920
-
Analysis of micro channels for integrated cooling
-
Weisberg, A.; Bau, H. H. and Zemel, J. N.; Analysis of micro channels for integrated cooling; Int. J. Heat Mass Transf., vol. 35, no. 10, 1992, pp. 2465-2474.
-
(1992)
Int. J. Heat Mass Transf
, vol.35
, Issue.10
, pp. 2465-2474
-
-
Weisberg, A.1
Bau, H.H.2
Zemel, J.N.3
-
17
-
-
3242717935
-
Three dimensional analysis of heat transfer in a micro heat sink with single phase flow
-
Li, J.; Peterson, G. P. and Cheng, P.; Three dimensional analysis of heat transfer in a micro heat sink with single phase flow; Int. J. Heat Mass Transf., vol. 47, 2004, pp. 4215-4231.
-
(2004)
Int. J. Heat Mass Transf
, vol.47
, pp. 4215-4231
-
-
Li, J.1
Peterson, G.P.2
Cheng, P.3
-
18
-
-
0036887847
-
Numerical computation of fluid flow and heat transfer in microchannels
-
Toh, K. C.; Chen, X. Y. and Chai, J. C.; Numerical computation of fluid flow and heat transfer in microchannels; Int. J. Heat Mass Transf, vol. 45, 2002, pp. 5133-5141.
-
(2002)
Int. J. Heat Mass Transf
, vol.45
, pp. 5133-5141
-
-
Toh, K.C.1
Chen, X.Y.2
Chai, J.C.3
-
19
-
-
33644800848
-
Geometric optimization of a micro heat sink with liquid flow
-
Mar
-
Li, J. and Peterson, G. P.; Geometric optimization of a micro heat sink with liquid flow; IEEE Trans. Compon. Packag. Technol., vol. 29, no. 1, Mar. 2006, pp. 145-154.
-
(2006)
IEEE Trans. Compon. Packag. Technol
, vol.29
, Issue.1
, pp. 145-154
-
-
Li, J.1
Peterson, G.P.2
-
21
-
-
17444368645
-
Surrogate-based analysis and optimization
-
Queipo, N. V.; Hafika, R. T.; Shyy, W.; Goel, T.; Vaidyanathan, R.; Tucker, P. K.; Surrogate-based analysis and optimization; Progress in Aerospace Sciences, vol. 41, 2005, pp. 1-28.
-
(2005)
Progress in Aerospace Sciences
, vol.41
, pp. 1-28
-
-
Queipo, N.V.1
Hafika, R.T.2
Shyy, W.3
Goel, T.4
Vaidyanathan, R.5
Tucker, P.K.6
-
22
-
-
0037683086
-
Challenges, developments and applications of silicon deep reactive ion etching
-
Laermer, F. and Urban, A.; Challenges, developments and applications of silicon deep reactive ion etching; Microelectron, Eng., vol 67-68, 2003, pp. 349-355.
-
(2003)
Microelectron, Eng
, vol.67-68
, pp. 349-355
-
-
Laermer, F.1
Urban, A.2
-
23
-
-
1942517653
-
MEMS fabrication
-
M. Gad-el-Hak, Ed. Boca Raton, FL: CRC
-
Madou, M. J.; MEMS fabrication, in the MEMS Handbook; M. Gad-el-Hak, Ed. Boca Raton, FL: CRC, vol 16-1, 2002.
-
(2002)
MEMS Handbook
, vol.16 -1
-
-
Madou, M.J.1
-
24
-
-
84885289284
-
-
CFX-5.7, Solver Theory, ANSYS 2004.
-
CFX-5.7, Solver Theory, ANSYS 2004.
-
-
-
-
25
-
-
85040205541
-
Numerical heat transfer and fluid flow
-
Patankar, S. V.; Numerical heat transfer and fluid flow; New York : McGraw-Hill, 1980, pp. 124-134.
-
(1980)
New York : McGraw-Hill
, pp. 124-134
-
-
Patankar, S.V.1
-
26
-
-
17444414416
-
Use of Kriging models to approximate deterministic computer models
-
Martin, J. D. and Simpson, T. W.; Use of Kriging models to approximate deterministic computer models; AIAA Journal, vol. 43, no. 4, 2005, pp. 853-863.
-
(2005)
AIAA Journal
, vol.43
, Issue.4
, pp. 853-863
-
-
Martin, J.D.1
Simpson, T.W.2
-
27
-
-
84885279042
-
Laminar flow forced convection in ducts: A source book for compact heat exchanger analytical data
-
Shah, R. K. and London, A. L.; Laminar flow forced convection in ducts: a source book for compact heat exchanger analytical data; New York: Supl I. Academic press, 1978.
-
New York: Supl I. Academic press, 1978
-
-
Shah, R.K.1
London, A.L.2
-
28
-
-
10444244236
-
A MATLAB Kriging Toolbox
-
Technical Report IMM-TR2002-12
-
Lophaven, S. N.; Nielsen, H. B. and Sondergaard, J.; A MATLAB Kriging Toolbox; Technical Report IMM-TR2002-12, 2002.
-
(2002)
-
-
Lophaven, S.N.1
Nielsen, H.B.2
Sondergaard, J.3
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