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Volumn , Issue , 2007, Pages 201-208

Design optimization of micro-channel for micro electronic cooling

Author keywords

[No Author keywords available]

Indexed keywords

CONJUGATE HEAT TRANSFER; MICRO ELECTRONIC COOLING; PUMPING POWER;

EID: 37249038500     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2007-30053     Document Type: Conference Paper
Times cited : (9)

References (28)
  • 1
    • 0019563707 scopus 로고
    • High-performance heat sinking for VLSI
    • PP
    • Tuckerman, D. B. and Pease, R. F. W.; High-performance heat sinking for VLSI; IEEE Electron device Lett., vol. EDL-2, 1981, PP. 126-129.
    • (1981) IEEE Electron device Lett , vol.EDL-2 , pp. 126-129
    • Tuckerman, D.B.1    Pease, R.F.W.2
  • 2
    • 51249172090 scopus 로고
    • Convective heat transfer in microchannels
    • Samalam, V. K.; Convective heat transfer in microchannels; J. Electron mater., vol. 18, 1989, pp. 611-617.
    • (1989) J. Electron mater , vol.18 , pp. 611-617
    • Samalam, V.K.1
  • 4
    • 0342948889 scopus 로고    scopus 로고
    • Three dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
    • Fedorov, A. G. and Viskanta, R.; Three dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging; Int. J. Heat Mass Transfer, vol. 43, 2000, pp. 399-415.
    • (2000) Int. J. Heat Mass Transfer , vol.43 , pp. 399-415
    • Fedorov, A.G.1    Viskanta, R.2
  • 5
    • 0032290339 scopus 로고    scopus 로고
    • Kawano, K.; Minakami, K.; Iwasaki, H.; Ishizuka, M.; Application of Heat Transfer in Equipment Systems, and Education; in Development of microchannels heat exchanging, R.A. Nelson Jr., L. W. Swanson, M.V.A. Bianchi, and C. Camci, Eds. New York: ASME, 1998, HTD-361-3/PID-3, 1998, pp. 173-180.
    • Kawano, K.; Minakami, K.; Iwasaki, H.; Ishizuka, M.; Application of Heat Transfer in Equipment Systems, and Education; in Development of microchannels heat exchanging, R.A. Nelson Jr., L. W. Swanson, M.V.A. Bianchi, and C. Camci, Eds. New York: ASME, 1998, vol. HTD-361-3/PID-3, 1998, pp. 173-180.
  • 6
    • 0023421550 scopus 로고
    • A thermal module design for advancing packaging
    • Turlik, L. T. I. and Reisman, A.; A thermal module design for advancing packaging; J. Electron Mater., vol. 16, no. 5, 1987, pp. 347-355.
    • (1987) J. Electron Mater , vol.16 , Issue.5 , pp. 347-355
    • Turlik, L.T.I.1    Reisman, A.2
  • 7
    • 0027841770 scopus 로고    scopus 로고
    • Rahman, M. M. and Gui, F.; Experimental measurements of fluid flow and heat transfer in microchannel cooling passages in a chip substrate; Adv. Electron. Packag., ASME EEP-4, no. 2, 1993, pp. 685-692.
    • Rahman, M. M. and Gui, F.; Experimental measurements of fluid flow and heat transfer in microchannel cooling passages in a chip substrate; Adv. Electron. Packag., vol. ASME EEP-4, no. 2, 1993, pp. 685-692.
  • 9
    • 0037570768 scopus 로고    scopus 로고
    • Friction factors in smooth trapezoidal silicon micro channels with different aspect ratios
    • Jul
    • Wu, H. Y. and Cheng, P.; Friction factors in smooth trapezoidal silicon micro channels with different aspect ratios; Int. J. Heat Mass Transf., vol. 46, no. 14, Jul. 2003, pp. 2519-2525.
    • (2003) Int. J. Heat Mass Transf , vol.46 , Issue.14 , pp. 2519-2525
    • Wu, H.Y.1    Cheng, P.2
  • 10
    • 0037908834 scopus 로고    scopus 로고
    • An experimental study of convective heat transfer in silicon micro channels with different surface conditions
    • Jul
    • Wu, H. Y. and Cheng, P.; An experimental study of convective heat transfer in silicon micro channels with different surface conditions; Int. J. Heat Mass Transf., vol. 46, no. 14, Jul. 2003, pp. 2547-2556.
    • (2003) Int. J. Heat Mass Transf , vol.46 , Issue.14 , pp. 2547-2556
    • Wu, H.Y.1    Cheng, P.2
  • 11
    • 85162221694 scopus 로고    scopus 로고
    • Transport in micro channels-A critical review; Annu
    • Gerimella, S. V. and Sobhan, C. B.; Transport in micro channels-A critical review; Annu. Rev. Heat Tansf., vol. 13, 2003, pp. 1-50.
    • (2003) Rev. Heat Tansf , vol.13 , pp. 1-50
    • Gerimella, S.V.1    Sobhan, C.B.2
  • 12
    • 0030201144 scopus 로고    scopus 로고
    • Convective heat transfer and flow friction for water flow in microchannel structures
    • Jul
    • Peng, X. F. and Peterson, G. P.; Convective heat transfer and flow friction for water flow in microchannel structures; Int. J. Heat Mass Transf, vol. 39, no. 12, Jul. 1996, pp. 2599-2608.
    • (1996) Int. J. Heat Mass Transf , vol.39 , Issue.12 , pp. 2599-2608
    • Peng, X.F.1    Peterson, G.P.2
  • 13
    • 2542481532 scopus 로고    scopus 로고
    • Knight, R. W.; Hall, D. J.; Goodling, J. S. and Jaeger, R. C.; Heat sink optimization with application to micro channels, IEEE Trans. Compon., Hybrids, Manufact. Technol., 15, no. 5, Oct. 1992, pp. 832-842.
    • Knight, R. W.; Hall, D. J.; Goodling, J. S. and Jaeger, R. C.; Heat sink optimization with application to micro channels," IEEE Trans. Compon., Hybrids, Manufact. Technol., vol. 15, no. 5, Oct. 1992, pp. 832-842.
  • 14
    • 0037804797 scopus 로고    scopus 로고
    • Optimization study of stacked micro-channel heat sinks for micro-electronic cooling
    • Mar
    • Wei, X. J. and Joshi, Y.; Optimization study of stacked micro-channel heat sinks for micro-electronic cooling; IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, Mar. 2003, pp. 55-61.
    • (2003) IEEE Trans. Compon. Packag. Technol , vol.26 , Issue.1 , pp. 55-61
    • Wei, X.J.1    Joshi, Y.2
  • 15
    • 0035521208 scopus 로고    scopus 로고
    • Optimal shapes of fully embedded channels for conjugate cooling
    • Nov
    • Fisher, T. S. and Torrance, K. E.; Optimal shapes of fully embedded channels for conjugate cooling; IEEE Trans. Adv. Packag., vol. 24, no. 4, Nov. 2001, pp. 555-562.
    • (2001) IEEE Trans. Adv. Packag , vol.24 , Issue.4 , pp. 555-562
    • Fisher, T.S.1    Torrance, K.E.2
  • 16
    • 0026939920 scopus 로고
    • Analysis of micro channels for integrated cooling
    • Weisberg, A.; Bau, H. H. and Zemel, J. N.; Analysis of micro channels for integrated cooling; Int. J. Heat Mass Transf., vol. 35, no. 10, 1992, pp. 2465-2474.
    • (1992) Int. J. Heat Mass Transf , vol.35 , Issue.10 , pp. 2465-2474
    • Weisberg, A.1    Bau, H.H.2    Zemel, J.N.3
  • 17
    • 3242717935 scopus 로고    scopus 로고
    • Three dimensional analysis of heat transfer in a micro heat sink with single phase flow
    • Li, J.; Peterson, G. P. and Cheng, P.; Three dimensional analysis of heat transfer in a micro heat sink with single phase flow; Int. J. Heat Mass Transf., vol. 47, 2004, pp. 4215-4231.
    • (2004) Int. J. Heat Mass Transf , vol.47 , pp. 4215-4231
    • Li, J.1    Peterson, G.P.2    Cheng, P.3
  • 18
    • 0036887847 scopus 로고    scopus 로고
    • Numerical computation of fluid flow and heat transfer in microchannels
    • Toh, K. C.; Chen, X. Y. and Chai, J. C.; Numerical computation of fluid flow and heat transfer in microchannels; Int. J. Heat Mass Transf, vol. 45, 2002, pp. 5133-5141.
    • (2002) Int. J. Heat Mass Transf , vol.45 , pp. 5133-5141
    • Toh, K.C.1    Chen, X.Y.2    Chai, J.C.3
  • 19
    • 33644800848 scopus 로고    scopus 로고
    • Geometric optimization of a micro heat sink with liquid flow
    • Mar
    • Li, J. and Peterson, G. P.; Geometric optimization of a micro heat sink with liquid flow; IEEE Trans. Compon. Packag. Technol., vol. 29, no. 1, Mar. 2006, pp. 145-154.
    • (2006) IEEE Trans. Compon. Packag. Technol , vol.29 , Issue.1 , pp. 145-154
    • Li, J.1    Peterson, G.P.2
  • 22
    • 0037683086 scopus 로고    scopus 로고
    • Challenges, developments and applications of silicon deep reactive ion etching
    • Laermer, F. and Urban, A.; Challenges, developments and applications of silicon deep reactive ion etching; Microelectron, Eng., vol 67-68, 2003, pp. 349-355.
    • (2003) Microelectron, Eng , vol.67-68 , pp. 349-355
    • Laermer, F.1    Urban, A.2
  • 23
    • 1942517653 scopus 로고    scopus 로고
    • MEMS fabrication
    • M. Gad-el-Hak, Ed. Boca Raton, FL: CRC
    • Madou, M. J.; MEMS fabrication, in the MEMS Handbook; M. Gad-el-Hak, Ed. Boca Raton, FL: CRC, vol 16-1, 2002.
    • (2002) MEMS Handbook , vol.16 -1
    • Madou, M.J.1
  • 24
    • 84885289284 scopus 로고    scopus 로고
    • CFX-5.7, Solver Theory, ANSYS 2004.
    • CFX-5.7, Solver Theory, ANSYS 2004.
  • 25
    • 85040205541 scopus 로고
    • Numerical heat transfer and fluid flow
    • Patankar, S. V.; Numerical heat transfer and fluid flow; New York : McGraw-Hill, 1980, pp. 124-134.
    • (1980) New York : McGraw-Hill , pp. 124-134
    • Patankar, S.V.1
  • 26
    • 17444414416 scopus 로고    scopus 로고
    • Use of Kriging models to approximate deterministic computer models
    • Martin, J. D. and Simpson, T. W.; Use of Kriging models to approximate deterministic computer models; AIAA Journal, vol. 43, no. 4, 2005, pp. 853-863.
    • (2005) AIAA Journal , vol.43 , Issue.4 , pp. 853-863
    • Martin, J.D.1    Simpson, T.W.2
  • 27
    • 84885279042 scopus 로고    scopus 로고
    • Laminar flow forced convection in ducts: A source book for compact heat exchanger analytical data
    • Shah, R. K. and London, A. L.; Laminar flow forced convection in ducts: a source book for compact heat exchanger analytical data; New York: Supl I. Academic press, 1978.
    • New York: Supl I. Academic press, 1978
    • Shah, R.K.1    London, A.L.2
  • 28
    • 10444244236 scopus 로고    scopus 로고
    • A MATLAB Kriging Toolbox
    • Technical Report IMM-TR2002-12
    • Lophaven, S. N.; Nielsen, H. B. and Sondergaard, J.; A MATLAB Kriging Toolbox; Technical Report IMM-TR2002-12, 2002.
    • (2002)
    • Lophaven, S.N.1    Nielsen, H.B.2    Sondergaard, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.