An experimental study on the effect of configuration of multiple microchannels on heat removal for electronic cooling

2010 14th International Heat Transfer Conference, IHTC 14

Volumn 3, Issue , 2010, Pages 473-480

  Zhang, Jingru ^a   Prakash, Shaurya ^b   Jaluria, Yogesh ^a   Lin, Lei ^c  

^a RUTGERS UNIVERSITY   (United States)

^b The Ohio State University   (United States)

^c RUTGERS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ETCH; COOLING EFFICIENCY; DATA ACQUISITION SYSTEM; EXPERIMENTAL STUDIES; FIN WIDTHS; HEAT REMOVAL; HEAT TRANSFER CHARACTERISTICS; ISO-PROPANOLS; LABVIEW SOFTWARE; MECHANICAL FLEXIBILITY; MICRO CHANNEL HEAT SINKS; MICROCHANNEL FLOW; OPEN FLOW; ORIENTED SILICON; PACKAGING PROCESS; PARAMETRIC STUDY; POTENTIAL APPLICATIONS; POWER SUPPLY; SYRINGE PUMPS; TEMPERATURE DATA; UV LITHOGRAPHY;

COMPUTER PROGRAMMING LANGUAGES; ELECTRONIC COOLING; HEAT SINKS; HEAT TRANSFER; POTASSIUM HYDROXIDE; SILICON WAFERS; SILICONES; WET ETCHING;

MICROCHANNELS;

EID: 84860507211     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IHTC14-22234     Document Type: Conference Paper

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