Numerical simulation of steady-state conjugate heat transfer in a circular microtube inside a rectangular substrate

Numerical Heat Transfer; Part A: Applications

Volumn 49, Issue 7, 2006, Pages 635-654

  Sharath, P ^a   Rao, C ^a   Rahman, Muhammad M ^a   Soliman, Hassan M ^b  

^a University of South Florida   (United States)

^b UNIVERSITY OF MANITOBA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; LAMINAR FLOW; NUSSELT NUMBER; PRANDTL NUMBER; REYNOLDS NUMBER; SUBSTRATES; THERMAL CONDUCTIVITY;

DIAMETER-TO-WAFER THICKNESS; MICROTUBE; SOLID-TO-FLUID THERMAL CONDUCTIVITY RATIO;

HEAT TRANSFER;

EID: 33745288162     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10407780500324897     Document Type: Article

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