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Volumn 15, Issue 6, 2012, Pages

Electric field accelerating interface diffusion in CuRuTaNSi stacks during annealing

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATING EFFECT; ATOM DIFFUSION; ELECTRIC FIELD ANNEALING; EXTERNAL ELECTRIC FIELD; INTERFACE DIFFUSION;

EID: 84860451485     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.023206esl     Document Type: Article
Times cited : (12)

References (33)
  • 4
    • 34248597634 scopus 로고    scopus 로고
    • Effect of a Ta-Si-N diffusion barrier on the texture formation in thin Cu films
    • DOI 10.1063/1.2720100
    • R. Hbner, J. Appl. Phys., 101, 093512 (2007). 10.1063/1.2720100 (Pubitemid 46759452)
    • (2007) Journal of Applied Physics , vol.101 , Issue.9 , pp. 093512
    • Hubner, R.1
  • 10
    • 33845259295 scopus 로고    scopus 로고
    • Comparative study of Cu-CVD seed layer deposition on Ru and Ta underlayers
    • DOI 10.1149/1.2392984
    • H. Kim and Y. Shimogaki, J. Electrochem. Soc., 154, G13 (2007). 10.1149/1.2392984 (Pubitemid 44866339)
    • (2007) Journal of the Electrochemical Society , vol.154 , Issue.1
    • Kim, H.1    Shimogaki, Y.2
  • 11
    • 43049105801 scopus 로고    scopus 로고
    • Improvement on the diffusion barrier performance of reactively sputtered Ru-N film by incorporation of Ta
    • DOI 10.1149/1.2905749
    • C. W. Chen, J. S. Chen, and J. S. Jeng, J. Electrochem. Soc., 155, H438 (2008). 10.1149/1.2905749 (Pubitemid 351623475)
    • (2008) Journal of the Electrochemical Society , vol.155 , Issue.6
    • Chen, C.-W.1    Chen, J.S.2    Jeng, J.-S.3
  • 16
    • 44349143842 scopus 로고    scopus 로고
    • 10.1007/s10853-008-2653-7
    • D. Yang and H. Conrad, J. Mater. Sci., 43, 4475 (2008). 10.1007/s10853-008-2653-7
    • (2008) J. Mater. Sci. , vol.43 , pp. 4475
    • Yang, D.1    Conrad, H.2
  • 17
    • 34249819693 scopus 로고    scopus 로고
    • Retardation of grain growth in electrodeposited Cu by an electric field
    • DOI 10.1007/s10853-006-0177-6
    • K. Jung and H. Conrad, J. Mater. Sci., 42, 3994 (2007). 10.1007/s10853-006-0177-6 (Pubitemid 46855309)
    • (2007) Journal of Materials Science , vol.42 , Issue.11 , pp. 3994-4003
    • Jung, K.1    Conrad, H.2
  • 26
    • 24644446014 scopus 로고    scopus 로고
    • 2 and Si
    • DOI 10.1016/j.apsusc.2005.02.025, PII S0169433205002254
    • M. Zier, S. Oswald, R. Reiche, and K. Wetzig, Appl. Surf. Sci., 252, 234 (2005). 10.1016/j.apsusc.2005.02.025 (Pubitemid 41282702)
    • (2005) Applied Surface Science , vol.252 , Issue.1 SPEC. ISS. , pp. 234-239
    • Zier, M.1    Oswald, S.2    Reiche, R.3    Wetzig, K.4
  • 28
    • 3142716841 scopus 로고    scopus 로고
    • 10.1023/B:JMSC.0000033403.34939.f9
    • Z. C. Hu, C. S. He, X. Zhao, and L. Zuo, J. Mater. Sci., 39, 4231 (2004). 10.1023/B:JMSC.0000033403.34939.f9
    • (2004) J. Mater. Sci. , vol.39 , pp. 4231
    • Hu, Z.C.1    He, C.S.2    Zhao, X.3    Zuo, L.4
  • 31
    • 0032483212 scopus 로고    scopus 로고
    • 10.1016/S1359-6462(98)00268-1
    • S. C. Li and H. Conrad, Scripta Mater., 39, 847 (1998). 10.1016/S1359-6462(98)00268-1
    • (1998) Scripta Mater. , vol.39 , pp. 847
    • Li, S.C.1    Conrad, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.