Effects of electrical field treatment on recrystallization of copper single crystal

Scripta Materialia

Volumn 52, Issue 6, 2005, Pages 495-499

  Liu, W ^a   Wu, T K ^a   Godfrey, A ^a   Liu, Q ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Copper; Electric field; Recrystallization; Twins

Indexed keywords

ANNEALING; BACKSCATTERING; COPPER; CRYSTALLIZATION; ELECTRIC FIELDS; MICROSTRUCTURE; NUCLEATION; SUPERPLASTICITY;

AUTOMATIC ELECTRON BACKSCATTER PATTERN (EBSP) SYSTEMS; CHARGE SHIELDING; MIGRATION RATES; TWINS;

SINGLE CRYSTALS;

EID: 10844227554     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.11.004     Document Type: Article

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