SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 320-323

Mechanisms of process-induced heating of MEMS structures during plasma release etch

(2) Gilgunn, Peter J a Fedder, Gary K a

a CARNEGIE MELLON UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IN-SITU; INDUCED HEATING; INDUCTIVELY-COUPLED; MEMS-STRUCTURE; RADIATIVE COOLING; RELEASE ETCH; SI-DRIE; STRUCTURE TEMPERATURE; TEMPERATURE RISE; TEMPERATURE TRENDS; TEST STRUCTURE;

ELECTROMAGNETIC INDUCTION; HEATING; INDUCTIVELY COUPLED PLASMA; MECHANICAL ENGINEERING; MECHANICS; REACTIVE ION ETCHING; THERMOGRAPHY (IMAGING);

SILICON;

EID: 77952769551 PISSN: 10846999 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/MEMSYS.2010.5442500 Document Type: Conference Paper

Times cited : (1)

References (6)

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2
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3
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- Flamm, D.L.¹

4
- 77952785241
- SOI-CMOS-MEMS fabrication technology
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5
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- Surface temperature and thermal balance of probes immersed in high density plasma
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6
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- The power balance at substrate surfaces during plasma processing
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.