Stress-induced and electro-migration of electroplated copper thin film interconnections used for 3D integration

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011

Volumn 2, Issue , 2011, Pages 685-690

  Saito, Naoki ^a   Murata, Naokazu ^a   Tamakawa, Kinji ^a   Suzuki, Ken ^a   Miura, Hideo ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ANNEALED FILMS; APPLIED CURRENT; COPPER ATOMS; CRYSTALLOGRAPHIC QUALITY; DAMASCENE PROCESS; ELECTRICAL RELIABILITY; ELECTROPLATED COPPER; ELECTROPLATED FILMS; FAILURE RATE; FRACTURE MODE; HIGH THERMAL CONDUCTIVITY; HILLOCK FORMATION; LOCAL FUSION; MICRO TEXTURE; RESIDUAL TENSILE STRESS; ROOM TEMPERATURE; STRESS-INDUCED; STRESS-INDUCED MIGRATION; SULFUR ATOMS; THROUGH-SILICON-VIA; TIME-DEPENDENT;

ANNEALING; ATOMS; BRITTLE FRACTURE; COPPER; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; EXHIBITIONS; GRAIN BOUNDARIES; INTEGRATION; PRINTED CIRCUIT BOARDS; RESIDUAL STRESSES; SEMICONDUCTOR DEVICES; SULFUR; THERMAL CONDUCTIVITY; THIN FILMS;

ELECTROPLATING;

EID: 84860349153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2011-52058     Document Type: Conference Paper

References (6)

1. International Technology Roadmap for Semiconductor 2007
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3. Tamakawa, K., Sakutani, K., and Miura, "Effect of Micro Texture of Electroplated Copper Thin Films on Their Mechanical Properties", H., Journal of The Society of Materials Science Japan, 56, (2007), pp. 907-912 [in Japanese].
4. Muto, H., and Sakai, M., "The large-scale deformation of polycrystalline aggregates: Cooperative grain-boundary sliding", Acta Materialia, 48, (2000), pp. 4161-4167.
5. S-C. Chang, J-M. Shieh, K-C. Lin, B-T. Dai, T-C. Wang, C-F. Chen, M-S. Feng, and C-P. Lu," Investigation of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper", J. of Vacuum Science and Technology B, Vol. 19, (2001), pp. 767-773.
6. Rui, H., Robl, W., Ceri, H., and Dehm, G, "Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing, IEEE Trans. on Device and Materials Reliability, Vol. 10, (2010), pp. 47-54.