Fluctuation mechanism of mechanical properties of electroplated-copper thin films used for three dimensional electronic modules

Key Engineering Materials

Volumn 353-358, Issue PART 4, 2007, Pages 2954-2957

  Miura, Hideo ^a   Sakutani, Kazuhiko ^a   Tamakawa, Kinji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Columnar structure; Electroplated copper film; Stress strain curve; Thin film; Young' modulus

Indexed keywords

COPPER; ELASTIC MODULI; ELECTROPLATED PRODUCTS; FILM THICKNESS; POLYCRYSTALLINE MATERIALS; STRESS-STRAIN CURVES; TENSILE STRENGTH; THREE DIMENSIONAL;

COLUMNAR STRUCTURES; DEPOSITED FILMS; ELECTRONIC MODULES; ELECTROPLATED COPPER FILMS;

THIN FILMS;

EID: 36048969127     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-456-1.2954     Document Type: Conference Paper

References (3)

1. H. Ogi, N. Nakamura, and M. Hirao, Fatigue Fract. Engng. Struct. Vol. 28, (2005), p. 657
2. H. Ohta, et. al., Proc. of Asian Pacific Conf. on Fracture and Strength '93, Tsuchiura, Japan, (1993), p. 735
3. H. Miura and S. Ikeda, IEICE Trans. Electronics Vol. E82-C, No. 6, (1999), p. 830