Effect of micro texture of electroplated copper thin films on their mechanical properties

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 56, Issue 10, 2007, Pages 907-912

  Tamakawa, Kinji ^a   Sakutani, Kazuhiko ^a   Miura, Hideo ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Columnar structure; Electroplated copper film; Mechanical property; Micro texture; Stress strain curve

Indexed keywords

COLUMNAR STRUCTURE; ELECTROPLATED COPPER FILMS; STRESS STRAIN CURVES;

COPPER; ELASTIC MODULI; ELECTROPLATING; GRAIN BOUNDARY SLIDING; NANOINDENTATION; POLYCRYSTALLINE MATERIALS; STRESS ANALYSIS; TEXTURES;

THIN FILMS;

EID: 38349088140     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.56.907     Document Type: Article

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