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Materials Science and Engineering: A

Volumn 546, Issue , 2012, Pages 307-313

Effect of solute segregation on thermal creep in dilute nanocyrstalline Cu alloys

(4) Schäfer, Jonathan a Ashkenazy, Yinon b,c Albe, Karsten a Averback, Robert S c

a DARMSTADT UNIVERSITY OF TECHNOLOGY (Germany)

b HEBREW UNIVERSITY OF JERUSALEM (Israel)

c University of Illinois at Urbana Champaign (United States)

Author keywords

Creep; Grain boundary segregation; Grain boundary structure; Molecular dynamics; Nanocrystalline materials

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; COPPER ALLOYS; CREEP; GRAIN BOUNDARY SLIDING; IRON ALLOYS; MONTE CARLO METHODS; NANOCRYSTALLINE ALLOYS; NANOCRYSTALS; NIOBIUM ALLOYS; SEGREGATION (METALLOGRAPHY); TEMPERATURE DISTRIBUTION; ZIRCONIUM ALLOYS;

CREEP RATES; CU ALLOY; DYNAMICS SIMULATION; EFFECT OF SOLUTES; ELEVATED TEMPERATURE; GRAIN BOUNDARY SEGREGATION; GRAIN BOUNDARY STRUCTURE; GRAIN-BOUNDARIES; SOLUTE SEGREGATION; THERMAL CREEP;

MOLECULAR DYNAMICS;

EID: 84860114313 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2012.03.078 Document Type: Article

Times cited : (18)

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