Reaching theoretical strengths in nanocrystalline Cu by grain boundary doping

Scripta Materialia

Volumn 65, Issue 8, 2011, Pages 660-663

  Vo, N Q ^a   Schafer J ^b   Averback, R S ^a   Albe, K ^b   Ashkenazy, Y ^a,c   Bellon, P ^a  

^a University of Illinois at Urbana Champaign   (United States)

^b DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^c HEBREW UNIVERSITY OF JERUSALEM   (Israel)

Author keywords

Copper; Hall Petch; Molecular dynamics; Nanocrystalline alloy; Yield strength

Indexed keywords

ALLOYING ADDITIONS; GRAIN SIZE; GRAIN-BOUNDARY ENERGY; HALL-PETCH; MOLAR FRACTIONS; MOLECULAR DYNAMICS SIMULATIONS; NANOCRYSTALLINE CU; NANOCRYSTALLINES; SCALING BEHAVIOR; THEORETICAL STRENGTH;

COPPER ALLOYS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MOLECULAR DYNAMICS; NIOBIUM; NIOBIUM ALLOYS; YIELD STRESS;

NANOCRYSTALLINE ALLOYS;

EID: 80052272381     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.06.048     Document Type: Article

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