Characterization and failure analysis of 3D integrated systems using a novel plasma-FIB system

AIP Conference Proceedings

Volumn 1395, Issue , 2011, Pages 269-273

  Kwakman, Laurens ^a   Franz, German ^a   Taklo, Maaike Margrete Visser ^b   Klumpp, Armin ^c   Ramm, Peter ^c  

^a Thermo Fisher Scientific   (United States)

^b SINTEF   (Norway)

^c Fraunhofer Institut fur Festkorpertechnologie   (Germany)

Author keywords

3D Integration; Chip access; Failure Analysis; Plasma FIB technology; TSV; Wafer to Wafer bonding

Indexed keywords

EID: 84859951059     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3657902     Document Type: Conference Paper

References (6)

1. Semiconductor Industry Association, "The International Technology Roadmap for Semiconductors", 2009 edition
2. P. Ramm, J. Wolf, B. Wunderle, "Wafer-Level 3D System Integration" in Handbook of 3D Integration, edited by Philip Garrou, Chris Bower, Peter Ramm, Wiley-VCH, 2008 (ISBN: 978-3-527-32034-9)
3. H. Bender, C. Drijbooms and A. Radisic, this conference
4. N.S. Smith, W.P. Skoczylas, S.M. Kellogg, D.E. Kinion, P.P. Tesch, O. Sutherland, A. Aanesland, and R.W. Boswell: "High Brightness Inductively Coupled Plasma Source for High Current Focused Ion Beam Applications", J. Vac. Sci. Technol., 2006, B24 (6), pp. 2902-2906
5. A. Klumpp, P. Ramm, G. Franz, C. Rue and L. Kwakman "Reliability testing and Failure Analysis of 3D Integrated Systems", Proc. IITC / MAM Conf., Dresden, Germany, 2011
6. M.M.V. Taklo, T. Bakke, H.R. Tofteberg, L.G.W. Tvedt and H. Kristiansen: "Anisotropic Conductive Adhesive for Wafer-to-Wafer Bonding", Proc. IMAPS Device Packaging Conf., Scottsdale, Arizona, 2011