Anisotropic conductive adhesive for wafer-to-wafer bonding

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2011 Spring Conference

Volumn , Issue , 2011, Pages 204-209

  Taklo, M M V ^a   Bakke, T ^a   Tofteberg, H R ^a   Tvedt, L G W ^a   Kristiansen, H ^b  

^a SINTEF ICT   (Norway)

^b Mosaic Solutions AS and Conpart AS   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; BENZOCYCLOBUTENE; ELECTRICAL CONDUCTIVITY; ELECTRICAL CONTACTS; PERCOLATION LIMITS; POLYMER SPHERES; WAFER BONDING METHODS; WAFER TO WAFER BONDING;

ADHESIVE JOINTS; BUTENES; ELECTRIC CONDUCTIVITY; EXHIBITIONS; FILLED POLYMERS; SILICON; SOLVENTS; WAFER BONDING;

SILICON WAFERS;

EID: 84877864631     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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