Reliability testing and failure analysis of 3D integrated systems

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Klumpp, Armin ^a   Ramm, Peter ^a   Franz, German ^b   Rue, Chad ^b   Kwakman, Laurens ^b  

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^b Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; ELECTRICAL PARAMETER; INTEGRATED SYSTEMS; PHYSICAL ANALYSIS; PHYSICAL FAILURE ANALYSIS; RELIABILITY TESTING; RF SIGNAL; STANDARDIZED PROCEDURE; STEADY STATE; TEST CHIPS; THROUGH SILICON VIAS;

IMAGE RESOLUTION; MATERIALS TESTING; METALLIZING; RELIABILITY ANALYSIS; THREE DIMENSIONAL;

FAILURE ANALYSIS;

EID: 80052069406     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940362     Document Type: Conference Paper

References (4)

1. Semiconductor Industry Association, "The International Technology Roadmap for Semiconductors", 2009 Edition. SEMATECH:Austin, TX, 2009
2. P. Ramm, J. Wolf, B. Wunderle, "Wafer-Level 3D System Integration" in Handbook of 3D Integration, edited by Philip Garrou, Chris Bower, Peter Ramm, Wiley-VCH, 2008 (ISBN: 978-3-527-32034-9)
3. P. Ramm, A. Klumpp, J. Weber, "3D Integration Technologies for MEMS/IC Systems", Proc. IEEE Bipolar / BiCMOS Circuits and Technology Meeting, Capri - BCTM 2009, p. 138
4. N.S. Smith et al., "High brightness inductively coupled plasma source for high current focused ion beam applications", J. Vac. Sci. Technol. B 24 (6) (2006), pp. 2902-2906.