Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

Volumn , Issue , 2011, Pages

  Cauwe, Maarten ^a   Vandecasteele, Bjorn ^a   Gielen, An ^a   De Baets, Johan ^a   Van Den Brand, Jeroen ^b   Kusters, Roel ^b  

^a IMEC   (Belgium)

^b HOLST CENTRE   (Netherlands)

Author keywords

chip embedding; low cost; PET; roll to roll

Indexed keywords

ADHESIVE BONDING; CHIP EMBEDDING; COMPATIBLE PROCESS; ELECTRONIC SYSTEMS; FINE PITCH; LOW-COST; MAXIMUM TEMPERATURE; PROCESS FLOWS; ROLL TO ROLL; SURFACE MOUNTING; TECHNOLOGY DEVELOPMENT; THERMAL AND ELECTRICAL CONDUCTIVITY; THIN CHIPS;

COSTS; ELECTRIC CONDUCTIVITY; LABELS; MICROELECTRONICS; POLYETHYLENE TEREPHTHALATES; ROLL BONDING; SOLDERING; SURFACE MOUNT TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 84857606856     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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