Technology for embedding active dies

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 101-106

  Ostmann, Andreas ^a   De Baets, Johan ^b   Kriechbaum, Arno ^b   Kostner, Hannes ^b   Neumann, Alexander ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b IMEC ^*

Author keywords

Chip embedding; Die bonding; Lamination; Laser drilling

Indexed keywords

ADHESIVE PASTES; CHIP SCALE PACKAGES; COST EFFECTIVENESS; DIES; EMBEDDINGS; INFILL DRILLING; LAMINATING; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR LASERS;

CHIP EMBEDDING; COST-EFFECTIVE TECHNOLOGY; DIE BONDING; HIGH-ACCURACY POSITIONING; LAMINATION; LARGE-SCALE MANUFACTURING; LASER DRILLING; PRINTED CIRCUIT BOARD (PCBS);

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84875290346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. A. Ostmann, A. Neumann, S. Weser, E. Jung, L. Böttcher and H. Reichl, "Realization of a Stackable Package Using Chip in Polymer Technology", Polytronic Conference, June 23.-26. 2002, Zalaegerszeg, Hungary.
2. W. Bauer, S. Purger, W. Schrittwieser, "Embedded Passive Technology from a Board Shops Perspective", CircuiTree Magazine October 2003.
3. A. Naumov, A. Kitai, S. Purger, W. Bauer, "Laser Trimming of Embedded Resistors for PWB Manufacturing", IMAPS Advanced Technology Workshop on Passive Integration, Ogunquit, Main, June 2002.
4. Hannes Stahr, Gnther Leising. "Interconnect solutions and material trends in future printed circuit boards", IMAPS Nordic Conference, Copenhagen, Sept. 2004.
5. HIDING DIES project website www.hidingdies.net
6. rd European Microelectronics and Packaging Symposium, Prague, June 2004, pp. 111-116.