Embedding active components inside Printed Circuit Board (PCB) - A solution for miniaturization of electronics

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 1-4

  Palm, P ^a   Moisala, J ^a   Kivikero, A ^a   Tuominen, R ^a   Iihola, A ^a  

^a Imbera Electronics Oy   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; RELIABILITY; SUBSTRATES;

ACTIVE COMPONENTS; ELECTRONICS SETS; ORGANIC SUBSTRATES; THIRD GENERATION MANUFACTURING PROCESS;

PRINTED CIRCUIT BOARDS;

EID: 33746502528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432034     Document Type: Conference Paper

References (7)

1. th IMAPS Nordic Conference, Espoo, Finland, September 2003, pp.101-107.
2. Kujala, A., Tuominen, R., Kivilahti, J.K., "Solderless interconnection and packaging technique for active components", IEEE Electronic Components and Technology Conference, The Proc. of 49th Electronic Components and Technology Conference (ECTC), 1999, pp. 155-159.
3. Tuominen, R, Palm, P, "Development of industrial scale manufacturing line for Integrated Module Board technology", The Sixth VSLI Packaging Workshop of Japan Technical Digest, Kyoto 12 - 14 November, 2002 pp. 13-17
4. th International Symposium on Microelectronics (IMAPS), 2003, pp.247-250.
5. Yim, M-J, Ryu, W., Jeon, Y-D, Lee, J., Ahn, S., Kim, J., Paik, K-W, "Microwave Model of Anisotropic Conductive Film Flip-Chip Interconnections for High Frequency Applications," IEEE Transactions On Components And Packaging Technology, Vol. 22, no. 4, December 1999
6. Palm, P, Tuominen, R, Kivikero, A, "Integrated Module Board (IMB); an Advanced Manufacturing Technology For Embedding Active Components Inside Organic Substrate", IEEE Electronic Components and Technology Conference, The Proc. of 54th Electronic Components and Technology Conference (ECTC), 2004, s28p3
7. Palm. P., Tuominen, R., Karila, T., Kivikero A., Advanced Manufacturing Technology For Embedding Active Components Inside Organic Substrate, The Proceedings of IMAPS Nordic Annual Conference, 2004, pp. 170-173.