High integration density capacitors directly integrated in a single copper layer of printed circuit boards

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 19, Issue 1, 2012, Pages 298-304

  Taroata, Dan ^a   Fischer, Wolf Joachim ^a   Cheema, Tarik Ali ^b   Garnweitner, Georg ^b   Schmid, Günter ^c  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^c SIEMENS AG   (Germany)

Author keywords

Embedded capacitors; Nanoparticle dispersion; Printed circuit boards; Self assembled monolayer

Indexed keywords

CHEMICALLY MODIFIED; DIRECT INTEGRATION; EMBEDDED CAPACITOR; HIGH INTEGRATION DENSITY; INSULATION PROPERTY; NANOPARTICLE DISPERSION; SELF-ASSEMBLED; SINGLE COPPER;

CERAMIC CAPACITORS; DIELECTRIC PROPERTIES; NANOPARTICLES; PRINTED CIRCUIT BOARDS; SELF ASSEMBLED MONOLAYERS; SURFACE MOUNT TECHNOLOGY;

INTEGRATION;

EID: 84857279377     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2012.6148531     Document Type: Article

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