Fabrication of conductive metal lines by plate-to-roll pattern transfer utilizing edge dewetting and flexographic printing

Journal of Colloid and Interface Science

Volumn 343, Issue 1, 2010, Pages 301-305

  Kwak, Moon Kyu ^a   Shin, Kyu Ho ^b   Yoon, Eung Yeoul ^b   Suh, Kahp Y ^a,c  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Seoul National University   (South Korea)

Author keywords

Dewetting; Flexography; Pattern transfer; PDMS; Printing

Indexed keywords

ALUMINUM CYLINDERS; CONDUCTIVE INK; CONFORMAL CONTACTS; CYLINDRICAL SURFACE; DE-WETTING; ELASTOMERIC MOLDS; FLEXOGRAPHIC PRINTING; FLEXOGRAPHY; HIGH FIDELITY; METAL LINE; PATTERN TRANSFER; PATTERN TRANSFERS; PDMS MOLDS; PHOTORESIST LAYERS; POTENTIAL APPLICATIONS; ROLL TO ROLL;

ELECTRIC RESISTANCE; INK; MICROCHANNELS; MOLDS; OFFSET PRINTING; PLATE METAL; PRINTING PRESSES; SILVER;

SILICONES;

ALUMINUM; DIMETICONE; INK;

ARTICLE; BIOTECHNOLOGICAL PROCEDURES; CONDUCTANCE; EDGE DEWETTING; FABRICATION; FILM; MATERIAL COATING; PRINTING; PRIORITY JOURNAL; TRANSPORT KINETICS;

EID: 74449089871     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcis.2009.11.003     Document Type: Article

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