In-situ fabrication of flexible vertically integrated electronic circuits by inkjet printing

Journal of Alloys and Compounds

Volumn 486, Issue 1-2, 2009, Pages 706-710

  Wang, Zhuo ^a,b   Wu, Wenwen ^a,b   Yang, Qunbao ^a   Li, Yongxiang ^a   Noh, Chang Ho ^c  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Coating materials; Diffusion; Liquid solid reaction

Indexed keywords

COATING MATERIALS; HIGH TEMPERATURE TREATMENTS; IN-SITU FABRICATION; IN-SITU REACTIONS; INK-JET PRINTER; INK-JET PRINTING; INTEGRATED ELECTRONICS; LIQUID-SOLID REACTION;

DIFFUSION COATINGS; ELECTRON TUBES; ELECTROOPTICAL DEVICES; FLAT PANEL DISPLAYS; INTEGRATED CIRCUITS; LIQUIDS; PHOTOVOLTAIC CELLS; PLATING; PRINTERS (COMPUTER); PRINTING PRESSES; SILVER;

PLASTIC COATINGS;

EID: 70350093712     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.07.044     Document Type: Article

References (11)

1. Burroughes J.H., Bradley D.D.C., Brown A.R., Marks R.N., Mackay K., Friend R.H., Burns P.L., and Holmes A.B. Nature 347 (1990) 539-541
2. de Gans B.J., and Schubert U.S. Langmuir 20 (2004) 7789-7793
3. Bharathan J., and Yang Y. Appl. Phys. Lett. 72 (1998) 2660-2662
4. Moller M., Asaftei S., Corr D., Ryan M., and Walder L. Adv. Mater. 16 (2004) 1558-1562
5. Shim G.H., Han M.G., Sharp-Norton J.C., Creager S.E., and Foulger S.H. Mater. J. Chem. 28 (2008) 594-601
6. Guo T.F., Chang S.C., Pyo S.M., and Yang Y. Langmuir 18 (2002) 8142-8147
7. de Gans B.J., Duineveld P.C., and Schubert U.S. Adv. Mater. 16 (2004) 203-213
8. Lee H.H., Chou K.S., and Huang K.C. Nanotechnology 16 (2005) 2436-2441
9. Lee K.J., Jun B.H., Kim T.H., and Joung J. Nanotechnology 17 (2006) 2424-2428
10. Liu Z.C., Su Y., and Varahramyan K. Thin Solid Films 478 (2005) 275-279
11. Paraschak D., Bahners T., and Schollmeyer E. Appl. Phys. A 66 (1998) 66-75