Synthesis of Ag-Cu-Sn nanocrystalline alloys as intermediate temperature solder by high energy ball milling

Advanced Materials Research

Volumn 79-82, Issue , 2009, Pages 449-452

  Li, Liangfeng ^a   Qiu, Tai ^a   Yang, Jian ^a   Feng, Yongbao ^a  

^a NANJING TECH UNIVERSITY   (China)

Author keywords

Ag cu sn; Annealing; High energy ball milling; Intermediate temperature solder

Indexed keywords

AVERAGE GRAIN SIZE; HIGH-ENERGY BALL MILLING; INTERMEDIATE TEMPERATURES; MELTING TEMPERATURES; POLYDISPERSED PARTICLES; SEM; SMALL PARTICLES; SN ALLOYS; XRD;

BALL MILLING; COPPER ALLOYS; DISTANCE MEASUREMENT; FUNCTIONAL MATERIALS; HIGH ENERGY PHYSICS; MELTING POINT; MILLING (MACHINING); MILLING MACHINES; NANOCRYSTALLINE ALLOYS; POLYDISPERSITY; SILVER; SOLDERING ALLOYS; SPHERES; TIN; TIN ALLOYS;

SILVER ALLOYS;

EID: 74049089231     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.79-82.449     Document Type: Conference Paper

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