Development of SOP module technology based on LCP substrate for high frequency electronics applications

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 118-125

  Zhang, Xia ^a,b   Zhang, Qi ^a,b   Zou, Gang ^b   Chen, Liu ^b   Chen, Zhaonian ^b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FABRICATION; FREQUENCY MODULATION; METALLIZING; SUBSTRATES;

HIGH FREQUENCY ELECTRONICS; MODULE TECHNOLOGY; MULTI-STAGED FABRICATION; SHEAR-OFF-METHOD;

LIQUID CRYSTAL POLYMERS;

EID: 42549143980     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279988     Document Type: Conference Paper

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