Wafer defect inspection by neural analysis of region features

Journal of Intelligent Manufacturing

Volumn 22, Issue 6, 2011, Pages 953-964

  Chang, Chuan Yu ^a   Li, Chun Hsi ^b   Chang, Yung Chi ^a   Jeng, Muder ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

Author keywords

RBF neural network; Wafer defect detection

Indexed keywords

ARTIFICIAL NEURAL NETWORK; AUTOMATIC INSPECTION SYSTEM; DEFECT INSPECTION; DIE PACKAGING; HUMAN FATIGUE; HUMAN VISUAL; PERSONNEL COSTS; PERSONNEL RESOURCES; RBF NEURAL NETWORK; REGION FEATURE; SEMICONDUCTOR MANUFACTURING; WAFER DEFECT DETECTION; WAFER INSPECTION;

DEFECTS; INSPECTION; NEURAL NETWORKS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

ELECTRONICS PACKAGING;

EID: 84855512024     PISSN: 09565515     EISSN: 15728145     Source Type: Journal    
DOI: 10.1007/s10845-009-0369-4     Document Type: Article

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