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Volumn 40, Issue 1, 1999, Pages 51-60

Development of an automatic post-sawing inspection system using computer vision techniques

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER VISION; FACTORY AUTOMATION; FEATURE EXTRACTION; IMAGE ANALYSIS; INSPECTION; ONLINE SYSTEMS; QUALITY CONTROL;

EID: 0032674546     PISSN: 01663615     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0166-3615(99)00009-3     Document Type: Article
Times cited : (34)

References (13)
  • 1
    • 0030414834 scopus 로고    scopus 로고
    • Accurate prediction of kill ratios based on KLA defect inspection and critical area analysis
    • Elisa A., Strojwas A.J., Maly W.P. Accurate prediction of kill ratios based on KLA defect inspection and critical area analysis. SPIE. 2874:1996;75-84.
    • (1996) SPIE , vol.2874 , pp. 75-84
    • Elisa, A.1    Strojwas, A.J.2    Maly, W.P.3
  • 2
    • 0029768155 scopus 로고    scopus 로고
    • Using optical pattern filtering defect inspection tools and progress induces defects per wafer pass for process defect control
    • Aivis J.R., Satterfiled M.J., Gabella P. Using optical pattern filtering defect inspection tools and progress induces defects per wafer pass for process defect control. SPIE. 2725:1996;217-232.
    • (1996) SPIE , vol.2725 , pp. 217-232
    • Aivis, J.R.1    Satterfiled, M.J.2    Gabella, P.3
  • 3
    • 0344433680 scopus 로고
    • Inspection and analysis system for wafer patter defects
    • Lshikwa S. Inspection and analysis system for wafer patter defects. Hitachi Rev. 44(2):1995;103-106.
    • (1995) Hitachi Rev. , vol.44 , Issue.2 , pp. 103-106
    • Lshikwa, S.1
  • 4
    • 0344865462 scopus 로고    scopus 로고
    • Microscopy and analysis of wafer particles using a semiconductor defect review system
    • Yamasaki I., Akiba T., Tamochi R., Kumada T. Microscopy and analysis of wafer particles using a semiconductor defect review system. Hitachi Rev. 45(1):1996;7-10.
    • (1996) Hitachi Rev. , vol.45 , Issue.1 , pp. 7-10
    • Yamasaki, I.1    Akiba, T.2    Tamochi, R.3    Kumada, T.4
  • 5
    • 0029746959 scopus 로고    scopus 로고
    • Sub-0.25 micro defect analysis on 200 mm semiconductor wafers
    • Childs K.D., Paul D.F., Clough S.P. Sub-0.25 micro defect analysis on 200 mm semiconductor wafers. SPIE. 2725:1996;255-260.
    • (1996) SPIE , vol.2725 , pp. 255-260
    • Childs, K.D.1    Paul, D.F.2    Clough, S.P.3
  • 6
    • 0029727550 scopus 로고    scopus 로고
    • Process and machine mastering employing wafer inspection system
    • Schwart J., Sherman R. Process and machine mastering employing wafer inspection system. SPIE. 2725:1996;242-254.
    • (1996) SPIE , vol.2725 , pp. 242-254
    • Schwart, J.1    Sherman, R.2
  • 7
    • 0028751410 scopus 로고
    • Patterned wafer inspect by high resolution spectral estimation technique
    • July
    • B.H. Khalaj, H.K. Aghajan, T. Kailath, Patterned wafer inspect by high resolution spectral estimation technique, Machine Vision and Application, July, 1994, 178-185.
    • (1994) Machine Vision and Application , pp. 178-185
    • Khalaj, B.H.1    Aghajan, H.K.2    Kailath, T.3
  • 9
    • 0345728270 scopus 로고
    • Die-to-Database defect detection for reticules of 64 and 256 Mbit DRAMs
    • Eran Y., Greengerg G. Die-to-Database defect detection for reticules of 64 and 256 Mbit DRAMs. SPIE. 2512:1995;453-456.
    • (1995) SPIE , vol.2512 , pp. 453-456
    • Eran, Y.1    Greengerg, G.2
  • 12
    • 0029321933 scopus 로고
    • A fast thresholding selection procedure for multimodal and unimodal histograms
    • Tsai D.M. A fast thresholding selection procedure for multimodal and unimodal histograms. Pattern Recognit. Lett. 16:1995;653-666.
    • (1995) Pattern Recognit. Lett. , vol.16 , pp. 653-666
    • Tsai, D.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.