Thin Czochralski silicon solar cells based on diamond wire sawing technology

Solar Energy Materials and Solar Cells

Volumn 98, Issue , 2012, Pages 337-342

  Yu, Xuegong ^a   Wang, Peng ^a   Li, Xiaoqiang ^a   Yang, Deren ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Conversion efficiency; Diamond wire sawing; Mechanical strength; Solar cells; Thin silicon wafer

Indexed keywords

CONVENTIONAL CUTTING; CZOCHRALSKI SILICON; DIAMOND WIRE SAWING; FABRICATION PROCESS; LONG-WAVELENGTH-RANGE; MINORITY CARRIER LIFETIMES; PHOTOVOLTAIC INDUSTRY; SURFACE RECOMBINATIONS; THIN SILICON WAFER; THIN WAFERS; ULTRA-THIN; WAFER SURFACE; WAFER THICKNESS;

CARRIER LIFETIME; CONVERSION EFFICIENCY; DIAMOND CUTTING TOOLS; DIAMONDS; OPEN CIRCUIT VOLTAGE; SAWING; SEMICONDUCTING SILICON COMPOUNDS; SOLAR CELLS; SOLAR POWER GENERATION; STRENGTH OF MATERIALS; WIRE;

SILICON WAFERS;

EID: 84855301920     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2011.11.028     Document Type: Article

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