Fracture strength of polycrystalline silicon wafers for the photovoltaic industry

Journal of the American Ceramic Society

Volumn 92, Issue 11, 2009, Pages 2713-2717

  Borrero López, Oscar ^a,b   Vodenitcharova, Tania ^a   Hoffman, Mark ^a   Leo, Anthony J ^c  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

^b UNIVERSITY OF EXTREMADURA   (Spain)

^c Sydney Olympic Park ^*  (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

BIMODAL DISTRIBUTION; FOUR-POINT BENDING; FOUR-POINT BENDING TEST; FRACTOGRAPHIC OBSERVATIONS; FRACTURE STRENGTHS; HIGH STRESS; PHOTOVOLTAIC INDUSTRY; POLYCRYSTALLINE SILICON WAFERS; PRODUCTION YIELD; SURFACE CHIPS; UNIMODAL DISTRIBUTION; WEIBULL ANALYSIS; WEIBULL MODULUS;

BENDING TESTS; FRACTURE; PHOTOVOLTAIC CELLS; POLYSILICON; SEMICONDUCTING SILICON COMPOUNDS; SOLAR POWER GENERATION; TENSILE STRENGTH; WEIBULL DISTRIBUTION;

SILICON WAFERS;

EID: 70350491395     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2009.03287.x     Document Type: Article

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