Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1725-1730

  Riccio, M ^a   Rossi, L ^a   Irace, A ^a   Napoli, E ^a   Breglio, G ^a   Spirito, P ^a   Tagami, R ^b   Mizuno, Y ^b  

^a UNIVERSITY OF NAPLES FEDERICO II   (Italy)

^b TOYOTA MOTOR CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COLLECTOR VOLTAGE; CURRENT CONDUCTION; CURRENT DISTRIBUTION; CURRENT FILAMENTATION; EXPERIMENTAL MEASUREMENTS; LOCKIN THERMOGRAPHY; PEAK CURRENTS; POWER DEVICES; UNCLAMPED INDUCTIVE SWITCHING;

ELECTRIC CURRENT DISTRIBUTION MEASUREMENT; ELECTRIC EQUIPMENT; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); RELIABILITY ANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); TRANSIENT ANALYSIS;

ELECTRONIC EQUIPMENT TESTING;

EID: 84755161831     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.072     Document Type: Conference Paper

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