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Volumn , Issue 10, 2011, Pages 45-48

Fabrication of glass-based microfluidic devices with photoresist as mask

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[No Author keywords available]

Indexed keywords


EID: 83755196263     PISSN: 13921215     EISSN: None     Source Type: Journal    
DOI: 10.5755/j01.eee.116.10.878     Document Type: Article
Times cited : (9)

References (14)
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  • 4
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    • DOI 10.1088/0960-1317/16/11/010, PII S0960131706268645, 010
    • Sato H., Matsumura H., Keino S., Shoji S. An all SU-8 microfluidic chip with built-in 3D fine microstructures // J Micromech Microengineering, 2006. - Vol. 16. - P. 2318-2322. (Pubitemid 44679451)
    • (2006) Journal of Micromechanics and Microengineering , vol.16 , Issue.11 , pp. 2318-2322
    • Sato, H.1    Matsumura, H.2    Keino, S.3    Shoji, S.4
  • 5
    • 42549125999 scopus 로고    scopus 로고
    • Determining the optimal PDMS-PDMS bonding technique for microfluidic devices
    • Eddings M. A., Johnson M. A., Gale B. K. Determining the optimal PDMS-PDMS bonding technique for microfluidic devices // J Micromech Microengineering, 2008. - Vol. 18(6).
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  • 7
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    • Deep reactive ion etching of polyimide for microfluidic applications
    • Nguyen T. N. T., Lee N. Deep reactive ion etching of polyimide for microfluidic applications // J. Korean Phys. Soc., 2007. - Vol. 51. - P. 984-988.
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    • Nguyen, T.N.T.1    Lee, N.2
  • 8
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    • 6/Ar inductively coupled plasmas
    • DOI 10.1016/j.mee.2005.07.006, PII S0167931705003126
    • Park J. H., Lee N., Lee J., Park J. S., Park H. D. Deep dry etching of borosilicate glass using SF6 and SF 6/Ar inductively coupled plasmas // Microelectron Eng., 2005. - Vol. 82. - P. 119-128. (Pubitemid 41375882)
    • (2005) Microelectronic Engineering , vol.82 , Issue.2 , pp. 119-128
    • Park, J.H.1    Lee, N.-E.2    Lee, J.3    Park, J.S.4    Park, H.D.5
  • 9
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    • Investigation of porous silicon layers as passivation coatings for high voltage silicon devices
    • Kaunas: Technology
    • Šalucha D. K., Marcinkevièius. A. J. Investigation of Porous Silicon layers as Passivation Coatings for high voltage Silicon Devices // Electronics and Electrical Engineering. - Kaunas: Technology, 2007. - No. 7(79). - P. 43-46.
    • (2007) Electronics and Electrical Engineering , vol.79 , Issue.7 , pp. 43-46
    • Šalucha, D.K.1    Marcinkevièius, A.J.2
  • 10
    • 0030091421 scopus 로고    scopus 로고
    • Smoothing of ultrasonically drilled holes in borosilicate glass by wet chemical etching
    • Diepold T., Obermeier E. Smoothing of ultrasonically drilled holes in borosilicate glass by wet chemical etching // J Micromech Microengineering, 1996. - Vol. 6. - P. 29-32. (Pubitemid 126614848)
    • (1996) Journal of Micromechanics and Microengineering , vol.6 , Issue.1 , pp. 29-32
    • Diepold, T.1    Obermeier, E.2
  • 11
    • 33747591631 scopus 로고    scopus 로고
    • Defect-free wet etching through pyrex glass using Cr/Au mask
    • DOI 10.1007/s00542-006-0116-0, Symposium on Design, Test, Intergration and Packaging of MEMS/MOEMS
    • Tay F. E. H, Iliescu C., Jing J., Miao J. Defect-free wet etching through pyrex glass using Cr/Au mask // Microsyst Technol., 2006. - Vol. 12. - P. 935-939. (Pubitemid 44267981)
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  • 13
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    • Wet chemical etching of silicate glasses in hydrofluoric acid based solutions
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    • J. Mater. Sci. , vol.28 , pp. 6261-6273
    • Spierings, G.A.C.M.1
  • 14
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    • Planar quartz chips with submicron channels for two-dimensional capillary electrophoresis applications
    • PII S096013179887513X
    • Becker H., Lowack K., Manz A. Planar quartz chips with submicron channels for two-dimensional capillary electrophoresis applications // J Micromech Microengineering, 1998. - Vol. 8. - P. 24-28. (Pubitemid 128604777)
    • (1998) Journal of Micromechanics and Microengineering , vol.8 , Issue.1 , pp. 24-28
    • Becker, H.1    Lowack, K.2    Manz, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.