Dynamic feature monitoring technique applied to thin film deposition processes in an industrial pecvd tool

ASME 2011 International Manufacturing Science and Engineering Conference, MSEC 2011

Volumn 2, Issue , 2011, Pages 215-224

  Bleakie, Alexander ^a   Djurdjanovic, Dragan ^a  

^a The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHAMBER CLEANING; CHAMBER CONDITION; CHAMBER TEMPERATURE; CLEANING CYCLES; DYNAMIC FEATURES; EQUIPMENT DEGRADATION; EQUIPMENT MONITORING; GAUSSIAN MIXTURE MODEL; LINEAR DISCRIMINANT ANALYSIS; MAINTENANCE DECISIONS; MONITORING TECHNIQUES; RADIO FREQUENCY PLASMA; SEMICONDUCTOR FABRICATION PROCESS; SEMICONDUCTOR MANUFACTURING; THIN-FILM DEPOSITIONS; TOOL CONDITION;

CHEMICAL EQUIPMENT; CHEMICAL VAPOR DEPOSITION; DEPOSITION; DISCRIMINANT ANALYSIS; FEATURE EXTRACTION; MANUFACTURE; MICROELECTRONICS; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; SILICON WAFERS; THIN FILMS;

CONDITION MONITORING;

EID: 82455185951     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/MSEC2011-50041     Document Type: Conference Paper

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