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Volumn 517, Issue 17, 2009, Pages 4984-4988
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Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness
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Author keywords
Anchoring effect; Copper sulfide; Electroless plating; EMI SE; TEA
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Indexed keywords
ANCHORING EFFECT;
ANCHORING EFFECTS;
CHELATING AGENT;
CHELATING EFFECT;
CONCENTRATION OF;
COPPER SULFIDE;
COPPER SULFIDES;
DEPOSITED LAYER;
ELECTROLESS DEPOSITION;
ELECTROMAGNETIC INTERFERENCE SHIELDING EFFECTIVENESS;
EMI SE;
EMI SHIELDING EFFECTIVENESS;
FT-IR SPECTRUM;
HYDROGEN BONDINGS;
LASER RAMAN;
REDUCTION AGENTS;
SWELLING DEGREE;
SWELLING EFFECT;
TEA;
TEA SOLUTION;
TRIETHANOLAMINE;
VINYL ACETATES;
XRD;
CHELATION;
CONDUCTIVE PLASTICS;
COPPER;
ELECTROLESS PLATING;
ELECTROMAGNETIC COMPATIBILITY;
ELECTROMAGNETIC SHIELDING;
ELECTROPLATING;
HYDROGEN;
HYDROGEN BONDS;
LOCAL AREA NETWORKS;
MAGNETIC SHIELDING;
PHOTOELECTRIC DEVICES;
RADIATION PROTECTION;
SODIUM;
SPONTANEOUS EMISSION;
ELECTROMAGNETIC PULSE;
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EID: 65749092951
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2009.03.137 Document Type: Article |
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Times cited : (42)
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References (13)
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