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Volumn 8166, Issue , 2011, Pages

High resolution mask process and substrate for 20 nm and early 14 nm node lithography

Author keywords

Bright field masks; Chrome hard mask; Clear field masks; E beam resist; Mask inspection; Photomask cleaning; Photomask materials; Photomask substrates; Thin OMOG

Indexed keywords

E-BEAM RESIST; HARD MASKS; MASK INSPECTION; PHOTOMASK CLEANING; PHOTOMASK SUBSTRATES; THIN OMOG;

EID: 81455148979     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.898889     Document Type: Conference Paper
Times cited : (4)

References (5)
  • 1
    • 78649822092 scopus 로고    scopus 로고
    • Development and characterization of a thinner binary mask absorber for 22 nm node and beyond
    • T. Faure et. al.,"Development and Characterization of a Thinner Binary Mask Absorber for 22 nm Node and Beyond ," Proc SPIE, 7823, 7823J1-J12, (2010).
    • (2010) Proc SPIE , vol.7823
    • Faure, T.1
  • 2
    • 79955901387 scopus 로고    scopus 로고
    • Fundamental Investigation of Negative Tone Development (NTD) for the 22 nm Node (and Beyond)
    • G. Landie et al., "Fundamental Investigation of Negative Tone Development (NTD) for the 22 nm Node (and Beyond)", Proc SPIE 7972, 7970206-12 (2011).
    • (2011) Proc SPIE , vol.7972 , pp. 7970206-7970212
    • Landie, G.1
  • 3
    • 80455124038 scopus 로고    scopus 로고
    • Comparing positive and negative tone development process for printing the metal and contact layer of the 32- and 22-nm nodes
    • J. Bekeart et al., "Comparing positive and negative tone development process for printing the metal and contact layer of the 32- and 22-nm nodes", Journal of Micro/Nanolithography MEMS and MOEMS, Volume 9 Issue 4, (2010).
    • (2010) Journal of Micro/Nanolithography MEMS and MOEMS , vol.9 , Issue.4
    • Bekeart, J.1
  • 4
    • 81455147545 scopus 로고    scopus 로고
    • The impact of a thinner binary mask absorber on 22 nm and beyond mask inspectability and defect sensitivity
    • K. Badger et al., "The impact of a thinner binary mask absorber on 22 nm and beyond mask inspectability and defect sensitivity,", Proc SPIE, 8166-61, (2011).
    • (2011) Proc SPIE , vol.8166 , Issue.61
    • Badger, K.1
  • 5
    • 62649084533 scopus 로고    scopus 로고
    • Damage mechanisms and process optimization for photomasks with sub-resolution assist features
    • L. Kindt et al., "Damage Mechanisms and Process Optimization for Photomasks with Sub-Resolution Assist Features", Proc SPIE 7122, 71220I (2008).
    • (2008) Proc SPIE , vol.7122
    • Kindt, L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.