Self-alignment of silicon chips on wafers: The effect of spreading and wetting

Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011

Volumn 2, Issue , 2011, Pages 528-531

  Berthier, Jean ^a   Brakke, Kenneth ^b   Sanchez, Loic ^a   Di Cioccio, Léa ^a  

^a CEA LETI   (France)

^b SUSQUEHANNA UNIVERSITY   (United States)

Author keywords

3D microelectronics; Pinning; Self alignment; Spreading

Indexed keywords

3-D INTEGRATION; FULL INTEGRATION; MICROELECTRONIC SYSTEMS; MOTION OF THE CHIPS; ON-WAFER; PINNING; SELF ALIGNMENT; SELF-ASSEMBLY METHOD; SILICON CHIP; SPREADING; SURFACE EVOLVER SOFTWARE; UNSTABLE MODES;

ALIGNMENT; FLUIDICS; MICROELECTRONICS; NANOTECHNOLOGY; SEMICONDUCTING SILICON COMPOUNDS; THREE DIMENSIONAL;

SILICON WAFERS;

EID: 81455144126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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