3D system integration technology and 3D systems

Advanced Metallization Conference (AMC)

Volumn , Issue , 2009, Pages 479-485

  Fukushima, Takafumi ^a   Tanaka, Tetsu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3-D SYSTEM INTEGRATION; 3D SYSTEMS; KEY TECHNOLOGIES; LSI CHIPS; ON-WAFER; SELF ASSEMBLY PROCESS; SUPER CHIP INTEGRATION; THROUGH-SI VIA;

LAYERED MANUFACTURING; LSI CIRCUITS; METALLIZING; SELF ASSEMBLY; SILICON WAFERS; TECHNOLOGY; THREE DIMENSIONAL;

WAFER BONDING;

EID: 70349952024     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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