Self-alignment of silicon chips on wafers: A capillary approach

Journal of Applied Physics

Volumn 108, Issue 5, 2010, Pages

  Berthier, J ^a   Brakke, K ^b   Grossi, F ^a   Sanchez, L ^a   Di Cioccio, L ^a  

^a CEA LETI   (France)

^b SUSQUEHANNA UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT ACCURACY; CURRENT TECHNIQUES; FULL INTEGRATION; MICROELECTRONIC SYSTEMS; MOORE'S LAW; NUMERICAL SOFTWARE; ON-WAFER; SELF ALIGNMENT; SELF-ASSEMBLY METHOD; SILICON CHIP; SURFACE EVOLVER; THREE DIMENSIONAL INTEGRATION; UNSTABLE MODES;

ALIGNMENT; MICROELECTRONICS; ROBOTIC ASSEMBLY; SEMICONDUCTING SILICON COMPOUNDS;

SILICON WAFERS;

EID: 77956803291     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3466782     Document Type: Article

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