Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles

Scripta Materialia

Volumn 65, Issue 12, 2011, Pages 1097-1100

  Zhang, Y ^a   Zhang, H L ^a   Wu, J H ^a   Wang, X T ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Auger electron spectroscopy (AES); Coatings; Interface structure; Metal matrix composites (MMCs); Thermal conductivity

Indexed keywords

COPPER MATRIX COMPOSITE; CU MATRIX COMPOSITES; DIAMOND COMPOSITES; DIAMOND PARTICLES; ENHANCED THERMAL CONDUCTIVITY; HIGH THERMAL CONDUCTIVITY; INTERFACE STRUCTURE; LAYERED STRUCTURES; METAL MATRIX COMPOSITES (MMCS); TI COATING;

AUGER ELECTRON SPECTROSCOPY; COATINGS; DIAMONDS; METALLIC MATRIX COMPOSITES; SPARK PLASMA SINTERING; THERMAL CONDUCTIVITY; TITANIUM; TUNGSTEN;

PARTICLE REINFORCED COMPOSITES;

EID: 80455122742     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.09.028     Document Type: Article

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