Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 19, Issue 5, 2009, Pages 1161-1166

  XIA, Yang ^a   SONG, Yue qing ^a   LIN, Chen guang ^a   CUI, Shun ^a   FANG, Zhen zheng ^a  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

Author keywords

carbide forming elements; diamond Cu composite; interfacial layer; thermal boundary resistance; thermal conductivity

Indexed keywords

CARBIDE FORMING ELEMENTS; COATED DIAMOND PARTICLES; COPPER COMPOSITES; DIAMOND COMPOSITES; DIAMOND PARTICLES; DIAMOND SURFACES; HEAT SINK MATERIALS; INTERFACIAL BONDING; INTERFACIAL LAYER; INTERFACIAL THERMAL CONDUCTIVITY; MAGNETIC SPUTTERING; THERMAL BOUNDARY RESISTANCE;

CARBIDES; CHROMIUM; COPPER ALLOYS; COPPER SMELTING; DIAMONDS; HEAT SINKS; METALLURGY; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMOANALYSIS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 76449117539     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(08)60422-7     Document Type: Article

References (19)

1. WILDNER H., KNIPPSCHEER S., LANDGRAF J., and BOLLINA R. Manufacturing and applications of diamond composites for thermal management [R] (2006), High performance diamond composites for TM, Dübendorf
2. SCHUBERT T., TRINDADE B., and WEIβGÄRBER T. Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications [J]. Mater Sci Eng A 475 (2008) 39-44
3. DAVIS L.C., and ARTZ B.E. Thermal conductivity of metal-matrix composites [J]. J Appl Phys 77 10 (1995) 4954-4960
4. YOSHIDA K., and MORIGAMi H. Thermal properties of diamond/ copper composites materials [J]. Microelectronics Reliability 44 (2004) 303-308
5. DINWIDDIE R.B., BEECHER S.C., and ARYA P.V. Thermal conductivity of diamond composites [J]. Thermal Conductivity 22 (1994) 468-476
6. SCOTT O.M., and NICHOLAS M. The wetting and bonding of diamonds by copper-base binary alloys [J]. J Mater Sci 10 (1975) 1833-1840
7. POWELL B.R., YOUNGBLOOD G.E., HASSELMANN D.P.H., and BENTSEN L.D. Effect of thermal expansion mismatch on the thermal diffusivity of glass-Ni composites [J]. J Am Cerm Soc 63 9/10 (1990) 581-586
8. HASSELMANN D.P.H., JOHNSON L.F., SYED R., TAYLOR M.P., and CHYUNGI K. Heat conduction characteristics of a carbon fiber-reinforced lithium-alumino-silicate glass-ceramic [J]. J Mater Sci 22 (1987) 701-709
9. SCHUBERT T., CIUPIÑSKI Ł., ZIELIÑSKI W., MICHALSKI A., WEIβGÄRBER T., and KIEBACK B. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink application [J]. Scripta Materialia 58 (2008) 263-266
10. FLAQUER J., RÍOS A., MARTIN-MEIZISO A., and NOGALES S. Effect of diamond shapes and associated thermal boundary resistance on the thermal conductivity of diamond-based composites [J]. Computational Materials Science 41 2 (2007) 156-163
11. KLEINER S., KHALID F.A., RUCH P.W., and BEFFORT O. Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminum [J]. Scripta Materialia 55 (2006) 291-294
12. HU S.-c., CHANG K.-l., and SUNG J. Ultrahigh pressure sintering of polycrystalline diamond cubes [C]. In: LI Z.-h., ZHAO B., YI Y.-l., and LIU Y.-l. (Eds). Proceedings of the 5th Zhengzhou International Super-Hard Materials & Related Products Conference (2008), China Machine Press, Zhengzhou 70-76
13. WEBER L., and TAVANGAR R. On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X(X=Cr, B) diamond composites [J]. Scripta Materialia 57 (2007) 988-991
14. DUNN M., and TAYA M. The effective thermal conductivity of composites with coated reinforcement and the application to imperfect interfaces [J]. J Apply Phys 73 (1993) 1711-1722
15. CAMCOHOB Λ. In: HUANG J.-h. (Ed). Analysis of refractory compound [M] (1965), Shanghai Science and Technology Press, Shanghai 126-128 (in Chinese).
16. HASSELMANN D.P.H., and JOHNSON L.F. Effective thermal conductivity of composites with interfacial thermal barrier resistance [J]. Journal of Composite Materials 21 6 (1987) 508-515
17. TORQUATO S., and RINTOUL D.M. Effect of the interface on the properties of composite media [J]. Phys Rev Lett 75 (1995) 4067-4070
18. ZHOU Y.C., LONG S.G., and LIU Y.W. Thermal failure mechanism and failure threshold of SiC particle reinforced metal matrix composites induced by laser beam [J]. Mechanics of Materials 35 10 (2003) 1003-1020 (in Anglais).
19. p composites by plasma spraying [J]. Scripta Materialia 52 (2005) 51-56